Although the smart phone growth peaked, but a series of emerging applications, such as unmanned aerial vehicles, smart cars, virtual reality...... emerge in an endless stream。 Semiconductor technology in which play an important role in the future growth potential of the market is very large. The editorial department in conjunction with the semiconductor industry experts, research institutions and leading enterprises, selected in 2016 the most market potential of the ten major semiconductor technology, please pay attention.
1 new type of sensor
Take a look at Google, Facebook, Amazon these companies are doing? Is busy with the acquisition. Google from 2010 to the beginning of the average every week will acquire a company, involving artificial intelligence, VR, 3D, smart home, cloud technology. These new technology and new applications have a very crucial link, that is, the need for sensors.
In the future, the sensor will be the focus of innovation, such as motion sensors, can sense acceleration, gravity, etc.. Chemical sensors can be used to measure PM2.5 and pesticide residues. The altimeter can be used for indoor positioning. In addition, human-computer interaction technology, speech semantics, gesture recognition, motion tracking, eye tracking, etc., the sensor is almost endless innovation. With the popularity of the Internet of things, the popularity of intelligent hardware, the development potential will be enormous.
2 indoor positioning chip
GPS in the field of outdoor positioning has been widely used, but it has a very obvious defects is difficult for indoor positioning, and general civilian accuracy is not high enough (10m), with respect to the indoor navigation (1m) and a distance requirements. Thus, location service people about 80% periods of activity, is a blank spot. At the same time, it also contains a huge business opportunities. At present, Google, Microsoft, apple, Broadcom and other tech giants have started the study of indoor positioning technology. You can imagine, the future with the commercialization of indoor positioning chip technology, will bring a wave of innovation climax, its impact and application prospects will never be less than GPS.
Currently applied to the indoor positioning of a lot of technical solutions, the Broadcom Corp introduced a new chip for indoor positioning (BCM4752) with three-dimensional positioning function. This chip can provide indoor positioning system support via WiFi, Bluetooth or NFC technology. The chip can also be combined with other sensors, such as the phone's gyroscope, accelerometer, etc., will be calculated in real-time changes in the position. Broadcom Corp plans to put the chip in the smart phone.
3.3DXpoint
Storage is one of the most important parts of electronic products, and it is indispensable for electronic products as food. Each new storage technology will lead to the birth of the market concern. Moreover, 3DXpoint is by Intel and micron two industry's most influential companies focus on the release of technology.
The second half of 2015, Intel released a new lightning micron non-volatile memory technology 3D-Xpoint". It is understood, Intel SSD 3D-Xpoint performance and durability is amazing - IOPS performance than the traditional mainstream SSD faster than 7 times, the delay performance of more than 8 times, durability is enough to challenge the SLC-SSD level. Intel has been using 3D-Xpoint equipped with SSD memory products as a system to enhance the efficiency of the system, the gap between the opponent's killer products. The new generation platform is expected to be paired with Lake CPU Kaby in the third quarter of 2016 began shipping, there may be a burst of waves in the high-end SSD market, to bring a big threat to the memory of Samsung and other competitors.
It is reported that Samsung to counter Intel's offensive, is now redoubling its efforts to develop new memory products, trying to merge its DRAM and NAND flash technology advantages, catch launched in the year 2016. Samsung's positive due to the SSD market should show a significant change in the future.
4.NFC small payments
December 2015, Apple Corp and China UnionPay officially announced cooperation, will launch Pay Apple mobile payment service in China, is expected to be the fastest in early 2016 to use this service in mainland china. On the same day Apple announced cooperation with China UnionPay, China UnionPay also reached the agreement with Samsung Electronics Pay Samsung to introduce the Chinese market.
In recent years, the rapid outbreak of the mobile payment market, in 2014 the global mobile payment transactions reached 325 billion U.S. dollars, the next few years the global mobile payment market will maintain a compound growth rate of about 40%. With respect to the remote payment and NFC (near field payment) technology as the representative of the near-field payment. In terms of transactions, and hardware security has higher security, application scenarios is relatively small, use frequency is higher, once will be optimistic about the industry, but to apply in the Chinese market has been slow. With apple, Samsung and other international manufacturers to enter the Chinese market, also in the financial institutions, telecommunications operators, mobile phone manufacturers, such as the joint efforts of, there will be more and more equipped with NFC enabled mobile phone, the terminal has been developed. Future NFC applications are expected to begin to spread.
5.MCU+ wireless technology
Both German industrial 4.0, or "China manufacturing 2025", the core is intelligent manufacturing, manufacturing digital degree will enhance day by day, and the use of interconnected system to control the complex industrial production process, which makes the data across the network in a low consumption, safe and effective transmission becomes crucial. Thus, low power microcontroller + industrial Ethernet SoC chip, will become a development trend.
In all 4 of the industry's technology products, low power wireless link and micro controller will become the core of the entire system, MCU+ wireless technology, a new generation of solutions that can simplify the sense of intelligence and networking capabilities